Wire · operational-macro
Samsung to Use TSMC's 3nm for NVIDIA's NVHBM Base Die, Skipping Its Own 4nm, Report Says
◆ Sectors
◆ Geography
◆ Source
◆ Verified
Fusion42 · 20 October 2026 · Fusion42 review
Samsung will use TSMC's 3nm process for the logic base die in NVIDIA's NVHBM high-bandwidth memory, departing from its usual in-house 4nm production. This shift is driven by Nvidia's request for standardised manufacturing conditions across memory suppliers to ease validation and performance consistency for NVHBM, while Samsung continues integrated production for other HBM products.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung's move to use TSMC's 3nm process for NVHBM logic signals a break from its integrated production model that Nvidia has forced by demanding uniform specs across suppliers. You should evaluate your supply chain dependencies now as manufacturing standards are shifting toward consolidation and external sourcing in advanced logic processes.
◆ Coverage
13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
◆ Related on Wire
◆ Topics