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Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul ...
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Fusion42 · 18 October 2026 · Fusion42 review
Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation high-bandwidth memory chips, marking their first collaboration at the HBM manufacturing stage. Nvidia has asked Samsung and competitors to use TSMC's process for these base dies to standardise implementation across memory suppliers.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung's use of TSMC's process for Nvidia's memory chips opens up a new collaboration path and supply chain model for you if you make semiconductor components. This creates an opportunity to serve Nvidia's shifting multi-supplier strategy or compete on alternative manufacturing processes.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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