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NVIDIA's Development Of Custom HBM Drops Samsung's And TSMC's Foundry Rivalry ...

Published

18 October 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

United States

◆ Source

Read at wccftech.com →

◆ Verified

Fusion42 · 18 October 2026 · Fusion42 review

NVIDIA is developing a custom high-bandwidth memory (HBM) called NVHBM that requires Samsung, Micron, and SK hynix to produce the base die on TSMC's 3nm process node to ensure consistent performance and reduce quality verification steps. This collaboration marks a shift from Samsung's traditional turnkey approach and indicates a temporary alliance between Samsung and TSMC to meet GPU demand efficiently.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.

◆ ◆ The Wire takeaway

The competition between Samsung and TSMC temporarily softens as they unite on NVHBM base dies for NVIDIA. If you build semiconductors or related memory tech, this alliance opens a new route to scale consistent 3nm production fast.

◆ Coverage

13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026

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◆ Topics

Semiconductorsnvidiahbmtsmcsamsungsemiconductor3nm-process