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Samsung to Use TSMC Technology to Produce Next-Generation Memory Chips for Nvidia
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Fusion42 · 19 October 2026 · Fusion42 review
Samsung Electronics will use TSMC's 3-nanometer technology to produce base dies for Nvidia's next-generation custom HBM memory chips, marking their first collaboration at the HBM manufacturing stage. Nvidia has requested Samsung, SK Hynix, and Micron to employ TSMC's process for NVHBM base dies integrating Nvidia's custom memory controller.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung choosing TSMC's advanced process for Nvidia's custom memory signals a new production alliance that could open opportunities for suppliers of complementary components. You should explore partnerships to serve Nvidia's expanding HBM demand and watch Samsung's capacity moves closely.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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