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Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul ...
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Fusion42 · 18 October 2026 · Fusion42 review
Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, marking the first collaboration between Samsung and TSMC at this manufacturing stage. Nvidia has requested multiple memory suppliers, including Samsung, SK Hynix, and Micron, to use TSMC's process to standardise implementation across suppliers.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung is breaking from its usual production model to integrate TSMC's technology for Nvidia's memory chips, creating a new cross-competitor collaboration. If you make components for advanced memory chips, expect shifting supplier dynamics and potentially new production demands.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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