Wire · operational-macro
Samsung to use TSMC tech for Nvidia's next-gen memory chips: Report
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Fusion42 · 19 October 2026 · Fusion42 review
Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips, marking the first collaboration at this manufacturing stage. Nvidia has requested Samsung, SK Hynix, and Micron to use TSMC's process for NVHBM base dies and sixth-generation DRAM technology for core dies.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung partnering with TSMC's advanced process for Nvidia's memory chips signals a shift in chip manufacturing agreements. If you build chips or supply this sector, new collaborative opportunities or competitive threats may emerge rapidly.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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