Wire · operational-macro
Samsung to use TSMC's 3nm process for Nvidia's next-gen AI memory chips
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Fusion42 · 18 October 2026 · Fusion42 review
Samsung will use TSMC's 3nm manufacturing process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips, marking a strategic shift from Samsung's traditional in-house production model to collaborate with TSMC. This aligns with Nvidia's requirement for all primary memory suppliers to leverage TSMC's 3nm process for consistency and verification efficiency across the NVHBM product line.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Samsung’s shift to use TSMC's 3nm process for Nvidia’s AI memory chips opens a slot for you as TSMC’s capacity limits could leave gaps in supply. You must explore partnerships or alternative technologies now before Nvidia’s demand outpaces production.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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