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Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul ...
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Fusion42 · 19 October 2026 · Fusion42 review
Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips, marking a rare collaboration between the two foundry rivals. Nvidia is standardizing its custom HBM parts across suppliers including Samsung, SK Hynix, and Micron, pushing adoption of TSMC's process for base dies, though Samsung plans to continue in-house production for standard HBM and custom products for other customers.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 18 Oct 2026 and 19 Oct 2026.
◆ ◆ The Wire takeaway
Nvidia's move to unify memory chip production standards with Samsung using TSMC technology disrupts foundry competition and opens a new door for you in semiconductor manufacturing partnerships. This creates pressure to rethink your supplier strategy and highlights opportunities where scaling custom chip production may require flexible foundry alliances.
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13 sources · first reported 18 Oct 2026 · latest 19 Oct 2026
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