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TSMC May Help Samsung in Custom HBM Production
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Fusion42 · 15 September 2026 · Fusion42 review
Samsung is adopting a dual sourcing strategy for custom High Bandwidth Memory (HBM) base dies by incorporating both its own foundry and TSMC's processes to better satisfy varied customer demands, particularly targeting AI chip firms. This collaboration aims to leverage TSMC's technology and supply stability to expand Samsung's competitiveness in the custom HBM market.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 6 sources have reported it between 7 Sep 2026 and 15 Sep 2026.
◆ ◆ The Wire takeaway
Samsung's shift to dual foundry sourcing for custom HBM baseline dies opens new choices for AI chip founders to demand tailored memory solutions with greater performance and efficiency. You must revise supply dependencies now as TSMC joins your memory base die options.
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6 sources · first reported 7 Sep 2026 · latest 15 Sep 2026
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