[News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom

TSMC is accelerating 2nm capacity across five Taiwan fabs with 45% higher first-year output than 3nm achieved, targeting 70% CAGR through 2028; Samsung has signed an MOU with Broadcom to supply HBM4 memory and 2nm foundry services, positioning itself as an alternative as TSMC plans 10% price increases in 2027.

This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure.