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Wire · technology

TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on ...

17 August 2026 · By · Wire by Fusion42

Published

17 August 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

United States

◆ Source

Read at design-reuse.com →

◆ Verified

Fusion42 · 17 August 2026 · Fusion42 review

TSMC has doubled its advanced packaging production capacity annually over three years but still cannot meet AI semiconductor demand. Samsung is accelerating its 2nm mass production buildout in Texas and expanding foundry collaborations, while both firms delay High-NA EUV lithography deployment until around 2030.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

Your foundry roadmap needs to pivot as capacity constraints in AI chip packaging create an urgent supply bottleneck. Samsung's Texas plant buildout opens new US fab opportunities that you can target this year.

◆ Coverage

1 source · 17 Aug 2026

◆ Related on Wire

◆ Topics

Semiconductorstsmcsamsungadvanced-packaging2nm-nodesemiconductor-manufacturing