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Advanced packaging: Pricing power shifts as the market doubles!
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Fusion42 · 29 July 2026 · Fusion42 review
The advanced packaging market is set to double to over $120 billion by 2031, overtaking traditional packaging as it becomes central to AI system performance. Pricing power is consolidating with key suppliers of AI-specific technologies like TSMC and Japanese materials firms, creating supply chain bottlenecks that will persist until at least 2027.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
Advanced packaging is now the choke point for all high-performance hardware, and a handful of firms in Taiwan and Japan control the supply. If you're building with AI chips, your production schedule and cost are set by their capacity, which is sold out until 2027.
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1 source · 29 Jul 2026
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