Advanced packaging: Pricing power shifts as the market doubles!

The advanced packaging market is set to double to over $120 billion by 2031, overtaking traditional packaging as it becomes central to AI system performance. Pricing power is consolidating with key suppliers of AI-specific technologies like TSMC and Japanese materials firms, creating supply chain bottlenecks that will persist until at least 2027.

This Wire brief sits within Fusion42's coverage of Semiconductors. Wire is Fusion42's founder-focused intelligence feed: each story is connected to the funds and startups it names — every one with a live profile on Raise or Scout — so founders can follow the capital and the momentum behind the headline rather than just the headline itself. Wire analysis is one of the live surfaces Arthur reasons over.