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Samsung Joins TSMC in Stalling ASML's High NA EUV Rollout, Pushing the Costly ...
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Fusion42 · 11 August 2026 · Fusion42 review
Samsung joins TSMC in delaying the use of ASML's High Numerical Aperture EUV lithography machines, postponing their deployment to 1-nanometer chip production expected around 2030, citing lack of refinement and cost concerns.
This Wire brief sits within Fusion42's coverage of Semiconductors. Wire is Fusion42's founder-focused intelligence feed: each story is connected to the funds and startups it names — every one with a live profile on Raise or Scout — so founders can follow the capital and the momentum behind the headline rather than just the headline itself. Wire analysis is one of the live surfaces Arthur reasons over.
◆ ◆ The Wire takeaway
Samsung’s delay in adopting ASML’s High NA EUV machines signals a postponed shift in chip production tech that raises costs and complexity now. If you build tools or supply materials for next-gen semiconductors, re-evaluate your timing and dependencies for 1nm node projects.
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