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Wire · technology

Samsung Joins TSMC in Stalling ASML's High NA EUV Rollout, Pushing the Costly ...

11 August 2026 · By · Wire by Fusion42

Published

11 August 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

South Korea

◆ Source

Read at wccftech.com →

◆ Verified

Fusion42 · 11 August 2026 · Fusion42 review

Samsung joins TSMC in delaying the use of ASML's High Numerical Aperture EUV lithography machines, postponing their deployment to 1-nanometer chip production expected around 2030, citing lack of refinement and cost concerns.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 1 source has reported it.

◆ ◆ The Wire takeaway

Samsung’s delay in adopting ASML’s High NA EUV machines signals a postponed shift in chip production tech that raises costs and complexity now. If you build tools or supply materials for next-gen semiconductors, re-evaluate your timing and dependencies for 1nm node projects.

◆ Coverage

1 source · 11 Aug 2026

◆ Related on Wire

◆ Topics

Semiconductorssemiconductor-fabricationhigh-na-euvchip-manufacturingtsmcsamsungasml