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Samsung Joins TSMC in Stalling ASML's High NA EUV Rollout, Pushing the Costly ...

Published

11 August 2026

Topic

technology

Sectors

Semiconductors

Geography

South Korea

Source

Read at wccftech.com

Verified

Fusion42 · 11 August 2026 · Fusion42 review

Samsung joins TSMC in delaying the use of ASML's High Numerical Aperture EUV lithography machines, postponing their deployment to 1-nanometer chip production expected around 2030, citing lack of refinement and cost concerns.

This Wire brief sits within Fusion42's coverage of Semiconductors. Wire is Fusion42's founder-focused intelligence feed: each story is connected to the funds and startups it names — every one with a live profile on Raise or Scout — so founders can follow the capital and the momentum behind the headline rather than just the headline itself. Wire analysis is one of the live surfaces Arthur reasons over.

◆ The Wire takeaway

Samsung’s delay in adopting ASML’s High NA EUV machines signals a postponed shift in chip production tech that raises costs and complexity now. If you build tools or supply materials for next-gen semiconductors, re-evaluate your timing and dependencies for 1nm node projects.

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Topics

Semiconductorssemiconductor-fabricationhigh-na-euvchip-manufacturingtsmcsamsungasml