HBM is undergoing major changes

HBM (High-Bandwidth Memory) technology is undergoing a fundamental industry shift as the Base Die evolves from a simple memory support chip to a complex logic chip requiring advanced foundry processes. SK Hynix is partnering with TSMC and potentially Intel Foundry to co-develop HBM4, moving the market toward customised HBM products that integrate memory and advanced logic, shifting the competitive landscape beyond traditional memory manufacturers.

This Wire brief sits within Fusion42's coverage of Semiconductors.