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Wire · technology

Samsung Foundry Pivots Half of 4nm Capacity to HBM4: External Customers Compete With Own Fab

8 September 2026 · By · Wire by Fusion42

Published

8 September 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

South Korea

◆ Source

Read at techtimes.com →

◆ Verified

Fusion42 · 8 September 2026 · Fusion42 review

Samsung has redirected over half of its 4nm foundry capacity to produce high-bandwidth memory (HBM4) internally, limiting availability for external fabless customers who now compete with Samsung's own memory division for wafer capacity.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 3 sources have reported it between 7 Sep 2026 and 8 Sep 2026.

◆ ◆ The Wire takeaway

You now face Samsung reserving half its cutting-edge 4nm capacity for its own memory chips, cutting foundry slots available to you. Start looking for alternate foundries or readiness plans as Samsung's internal priorities block external wafer access.

◆ Coverage

3 sources · first reported 7 Sep 2026 · latest 8 Sep 2026

◆ Related on Wire

◆ Topics

Semiconductorsfoundry-capacityhb-memorysamsungsemiconductors4nm-process