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Samsung Foundry Allocates Half of 4 nm Capacity for HBM4 Base Dies

Published

7 September 2026

Topic

technology

Sectors

Semiconductors

Geography

South Korea

Source

Read at techpowerup.com

Verified

Fusion42 · 7 September 2026 · Fusion42 review

Samsung Foundry is allocating half of its 4 nm (SF4) manufacturing capacity to HBM4 base die production, enabling customers to integrate custom logic such as memory controllers and PHYs directly on the base die, which could boost performance and reduce module size. This capacity allocation is part of Samsung's effort to increase its share in the HBM market, which has risen to 38% by revenue in Q2 2026.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ The Wire takeaway

Samsung's 50% dedication of its advanced 4 nm capacity to HBM4 base dies opens a new door for chip makers seeking integrated custom memory logic. You can explore partnerships or customer pitches now to leverage this shift before competitors secure this scarce manufacturing resource.

Coverage

1 source · 7 Sep 2026

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Semiconductorssamsungfoundryhbm44nmchip-manufacturingcapacity