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Wire · technology

Samsung and ASML want bigger masks for High NA EUV

8 September 2026 · By · Wire by Fusion42

Published

8 September 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

South Korea

◆ Source

Read at fudzilla.com →

◆ Verified

Fusion42 · 9 September 2026 · Fusion42 review

Samsung Electronics is collaborating with ASML and industry partners to develop 12-inch photomasks for High Numerical Aperture EUV lithography, aiming to improve chip manufacturing efficiency and enable advanced DRAM production by 2028.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.

◆ ◆ The Wire takeaway

Samsung’s push for larger photomasks with ASML signals a rare opportunity for founders in chipmaking tools and materials to align with next-generation DRAM production needs before 2028. Your components or services could become essential as this bigger mask format redefines lithography workflows.

◆ Coverage

2 sources · 8 Sep 2026

◆ Related on Wire

◆ Topics

Semiconductorshigh-na-euvphotomaskssemiconductor-manufacturingchip-scalingasmlsamsung