ASML wins over TSMC, Samsung for EUV machines as AI demand surges

ASML has secured commitments from TSMC and Samsung to adopt its high numerical aperture extreme ultraviolet lithography machines by 2030 and 2028 respectively, aligning with Intel to meet rising AI chip demand. The companies also plan a major technology shift from 6-inch to 12-inch photomasks to increase productivity and reduce costs in semiconductor production.

This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure, and 3 sources have reported it.