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Wire · technology

ASML, TSMC, Samsung and Intel Agree on AI Chip Roadmap Through 2033

8 September 2026 · By · Wire by Fusion42

Published

8 September 2026

Topic

technology

◆ Sectors

SemiconductorsAI Infrastructure

◆ Geography

NetherlandsTaiwanSouth Korea

◆ Source

Read at startupfortune.com →

◆ Verified

Fusion42 · 8 September 2026 · Fusion42 review

ASML, TSMC, Samsung, and Intel have agreed on a roadmap to advance AI chip production using 12-inch High-NA EUV lithography systems with pilot lines by 2031 and production by 2033, marking a major industry standard shift driven by these key players.

This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure.

◆ ◆ The Wire takeaway

You must prepare for a major jump in chipmaking scale and cost as 12-inch High-NA equipment becomes standard by 2033. This will open opportunities to supply new equipment and materials while forcing chip startups to plan for longer development horizons.

◆ Coverage

1 source · 8 Sep 2026

◆ Related on Wire

◆ Topics

SemiconductorsAI Infrastructureai-chipssemiconductor-manufacturinghigh-na-euvindustry-roadmapasml-tsmc-samsung-intel