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Wire · technology

Samsung Joins TSMC in Stalling ASML's High NA EUV Rollout, Pushing the Costly ...

11 August 2026 · By · Wire by Fusion42

Published

11 August 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

South Korea

◆ Source

Read at wccftech.com →

◆ Verified

Fusion42 · 23 August 2026 · Fusion42 review

Samsung plans to deploy ASML's high-NA EUV lithography machines starting at the 1-nanometer chip node, delaying their use for earlier nodes due to refinement challenges. This aligns with TSMC's similar delay, suggesting that high-NA EUV technology will be crucial for advanced chip production at the 1nm scale and beyond.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 1 source has reported it.

◆ ◆ The Wire takeaway

Samsung’s delay on adopting ASML’s high-NA EUV tools for sub-2nm chips shifts your timing for next-gen chip design and manufacturing investments. You need to recalibrate supply commitments and focus on interim tech like multi-patterning for now.

◆ Coverage

1 source · 11 Aug 2026

◆ Related on Wire

◆ Topics

Semiconductorssemiconductorseuv-lithographyhigh-nachip-manufacturingsupply-chain