Wire · technology
ASML gets TSMC and Samsung excited about High-NA EUV
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Fusion42 · 8 September 2026 · Fusion42 review
ASML has secured agreements with TSMC, Samsung, and Intel to adopt High-NA EUV lithography machines with 12-inch masks, allowing up to 40% production increases. TSMC plans mass production starting 2030, Samsung as early as 2028, while Intel is already using the technology, marking a major step in advanced chip manufacturing driven by AI demand.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.
◆ ◆ The Wire takeaway
High-NA EUV tech is entering production scale with major chipmakers adopting 12-inch masks, creating a clear demand surge for advanced lithography tools. If you supply semiconductor equipment or materials compatible with High-NA EUV, you face a buying spree starting this year.
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2 sources · 8 Sep 2026
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