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Wire · technology

Taiwan's TSMC, ASML target 12-inch reticle pilot line by 2031

8 September 2026 · By · Wire by Fusion42

Published

8 September 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

Taiwan

◆ Source

Read at taiwannews.com.tw →

◆ Verified

Fusion42 · 8 September 2026 · Fusion42 review

TSMC and ASML are collaborating to develop 12-inch reticles for High-NA EUV lithography aiming for a pilot production line by 2031 and full readiness by 2033, which is expected to enhance semiconductor manufacturing productivity and reduce chip costs.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

TSMC and ASML pioneering 12-inch reticle tech cuts wafer patterning steps, dropping costs and boosting output. Semiconductor founders need to prepare for tighter competition as manufacturing efficiency leaps ahead.

◆ Coverage

1 source · 8 Sep 2026

◆ Related on Wire

◆ Topics

Semiconductorstsmcasmleuv-lithographysemiconductorsreticlechip-manufacturing