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Wire · technology

TSMC, ASML partner on 12-inch EUV photomasks for advanced chips

8 September 2026 · By · Wire by Fusion42

Published

8 September 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

Taiwan

◆ Source

Read at focustaiwan.tw →

◆ Verified

Fusion42 · 8 September 2026 · Fusion42 review

TSMC and ASML are partnering to develop 12-inch EUV photomasks with a pilot production line expected by 2031 and volume manufacturing by 2033, aiming to enhance productivity and reduce chip manufacturing costs for advanced chips.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

Your semiconductor manufacturing unit will need to prepare for a major shift to 12-inch EUV photomasks by 2031 to stay competitive. Lock in partners with experience in ASML’s High NA technology now to avoid costly delays later.

◆ Coverage

1 source · 8 Sep 2026

◆ Related on Wire

◆ Topics

Semiconductorstsmcasmleuv-lithographychip-manufacturingphotomasks