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CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028
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Fusion42 · 30 September 2026 · Fusion42 review
Growing AI chip sizes and higher HBM integration are driving demand for larger 2.5D packages, with TSMC's CoWoS-L expected to remain the main advanced packaging solution for AI chips through 2028, despite competition from Intel's EMIB technology.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it between 25 Sep 2026 and 29 Sep 2026.
◆ ◆ The Wire takeaway
AI chip makers using advanced packaging must plan to integrate TSMC's CoWoS-L technology through 2028 as it remains dominant despite Intel's cost-lowering EMIB challenge. You need to evaluate your packaging supply chain and consider partnerships to handle larger AI chip sizes cost-effectively.
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2 sources · first reported 25 Sep 2026 · latest 29 Sep 2026
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