TSMC develops EMIB-like packaging to retain AI chip orders amid CoWoS strain

TSMC is developing an EMIB-like advanced chip packaging technology with Kinsus to alleviate shortages in CoWoS capacity and retain AI chip orders amid heavy demand. The move aims to prevent customers from shifting orders to Intel, which offers EMIB packaging, while TSMC also ramps up investments in packaging and testing capacity in Taiwan.

This Wire brief sits within Fusion42's coverage of Semiconductors.