TSMC Reportedly Developing Advanced Packaging Technology Similar to Intel's EMIB

TSMC is reportedly developing an advanced packaging technology similar to Intel's EMIB, working with substrate maker Kinsus Interconnect Technology. The new approach differs from TSMC's existing CoWoS-L technology in which layer the silicon bridge is embedded and how the production process is organized, signaling a strategic effort to compete with Intel in high-density chip packaging.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.