TSMC explores new AI chip packaging with Kinsus

TSMC is developing an EMIB-like packaging technology with Taiwan-based Kinsus to address CoWoS capacity constraints for AI chips. This approach could improve cost, yield, and scalability for large multi-die AI packages, with competitors like Intel, Nvidia, and Google already exploring similar EMIB designs.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.