Wire · opportunities
Beyond CoWoS: Korean firms eye next AI packaging race
◆ Sectors
◆ Geography
◆ Source
◆ Verified
Fusion42 · 25 September 2026 · Fusion42 review
Samsung Electro-Mechanics and LG Innotek are developing advanced semiconductor substrate technologies to compete with TSMC's CoWoS-L packaging, which is expected to dominate AI semiconductor packaging through 2028. This reflects a strategic preparation by Korean firms for future AI packaging needs amid growing chip complexity and size.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it between 25 Sep 2026 and 29 Sep 2026.
◆ ◆ The Wire takeaway
Samsung Electro-Mechanics and LG Innotek are moving now to capture a share in AI chip packaging beyond TSMC’s CoWoS-L dominance. You can position your semiconductor business to exploit alternatives emerging in packaging tech as chip designs grow in size and complexity.
◆ Coverage
2 sources · first reported 25 Sep 2026 · latest 29 Sep 2026
◆ Related on Wire
◆ Topics