Wire · technology
TSMC Skips Hybrid Bonding For Now, Betting on Conventional Microbumps to Lead The Way
◆ Sectors
◆ Geography
◆ Source
◆ Verified
Fusion42 · 2 September 2026 · Fusion42 review
TSMC is delaying adoption of hybrid bonding silicon packaging technology and is instead focusing on advancing conventional microbump technology with 5-micrometer microbumps, targeting mass production by late 2028. This contrasts with industry peers who view hybrid bonding as the superior method for chip stacking.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
TSMC is sticking with refined microbump tech rather than shifting to hybrid bonding, giving suppliers and rivals a timeline to plan around conventional packaging improvements. You should prepare for a market where hybrid bonding adoption slows and microbump innovation remains key.
◆ Coverage
1 source · 2 Sep 2026
◆ Related on Wire
◆ Topics