Wire · technology
TSMC Achieves 98% Yield on CoWoS-L with 5.5x Reticle Size, 14x Comes in 2029
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Fusion42 · 13 August 2026 · Fusion42 review
TSMC has reached a 98% yield on its CoWoS-L packaging technology enabling mass production of 5.5x reticle size chips, and is on track to package up to 14x reticle size silicon by 2029 with its A13 node. The company is also advancing its SoIC hybrid bonding technology to further increase interconnect density and energy efficiency.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 3 sources have reported it between 12 Aug 2026 and 13 Aug 2026.
◆ ◆ The Wire takeaway
TSMC's progress means semiconductor founders can now design much larger chips with confidence in packaging yields, opening new opportunities in chip complexity and integration this year and looking ahead to 2029. You need to prepare for collaboration closely with TSMC to leverage advanced packaging or risk missing the leap in performance and scale it enables.
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3 sources · first reported 12 Aug 2026 · latest 13 Aug 2026
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