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Xiaomi Unveils In-House 'Xring O3' SoC Built On TSMC's 3nm Process, Will Power Xiaomi 18 Fold
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Fusion42 · 26 August 2026 · Fusion42 review
Xiaomi has launched its in-house Xring O3 smartphone system-on-chip built on TSMC's 3nm process, powering its upcoming Xiaomi 18 Fold device. This strategic move aims to reduce reliance on external chip suppliers and strengthen Xiaomi's control over its supply chain, targeting significant market adoption in China.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 24 Aug 2026 and 25 Aug 2026.
◆ ◆ The Wire takeaway
Xiaomi's move into advanced chipmaking with TSMC’s 3nm process changes your competition landscape if you work in smartphone or semiconductor supply chains. This shift lets Xiaomi bypass Qualcomm and MediaTek dominance, opening new opportunities for component suppliers and challengers.
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13 sources · first reported 24 Aug 2026 · latest 25 Aug 2026
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