Wire · technology
[News] Xiaomi XRING O3 Reportedly Features CXMT LPDDR6 and TSMC 3nm, May ...
◆ Sectors
◆ Geography
◆ Source
◆ Verified
Fusion42 · 26 August 2026 · Fusion42 review
Xiaomi launched the XRING O3 flagship mobile processor supporting LPDDR6 memory supplied by CXMT, manufactured on TSMC's 3nm process. Xiaomi is expanding its XRING chip lineup using TSMC manufacturing, including chips for AI and autonomous driving, with mass production underway and deployment planned for 2026.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 24 Aug 2026 and 25 Aug 2026.
◆ ◆ The Wire takeaway
Xiaomi’s shift to TSMC’s advanced 3nm node and use of domestic CXMT LPDDR6 signals new tech standards in Chinese mobile chips. You need to prepare for faster, more integrated chip designs as Xiaomi pushes into AI and automotive markets with its expanded TSMC partnership.
◆ Coverage
13 sources · first reported 24 Aug 2026 · latest 25 Aug 2026
◆ Topics