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Wire · technology

Xiaomi launches new Xring chip, partners with TSMC for production: Report

24 August 2026 · By · Wire by Fusion42

Published

24 August 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

China

◆ Source

Read at enterpriseai.economictimes.indiatimes.com →

◆ Verified

Fusion42 · 24 August 2026 · Fusion42 review

Xiaomi has launched its new Xring O3 smartphone processor, manufactured by TSMC using 3nm technology, targeting flagship folding phones with an initial shipment goal of 200,000 to 300,000 units.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 24 Aug 2026 and 25 Aug 2026.

◆ ◆ The Wire takeaway

Xiaomi's shift to producing flagship chips with TSMC's cutting-edge 3nm process opens supply chain control and reduces dependency on external suppliers. If you build components or software for folding smartphones, prepare for new performance and scaling demands.

◆ Coverage

13 sources · first reported 24 Aug 2026 · latest 25 Aug 2026

◆ Topics

Semiconductorsxiaomitsmc3nmsmartphone-chipmanufacturing-partnership