Wire · technology
Xiaomi launches new Xring chip, partners with TSMC for production, sources say
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Fusion42 · 24 August 2026 · Fusion42 review
Xiaomi has launched its new Xring O3 smartphone processor, produced in partnership with TSMC using 3-nanometre technology, aiming to power its next flagship foldable phone. The company is also developing additional Xring chips for AI and autonomous driving, signalling a push to reduce reliance on external chip suppliers and compete with rivals like Huawei.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 13 sources have reported it between 24 Aug 2026 and 25 Aug 2026.
◆ ◆ The Wire takeaway
Xiaomi’s move to manufacture advanced chips with TSMC opens production capacity and shifts supply chain control in your sector. You can now target customers moving away from Qualcomm and MediaTek dependency, especially in premium foldable smartphones.
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13 sources · first reported 24 Aug 2026 · latest 25 Aug 2026
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