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Xiaomi launches new Xring chip, partners with TSMC for production, sources say

Published

24 August 2026

Topic

technology

Sectors

Semiconductors

Geography

China

Source

Read at devdiscourse.com

Verified

Fusion42 · 24 August 2026 · Fusion42 review

Xiaomi has launched its new Xring O3 smartphone processor, produced in partnership with TSMC using 3-nanometre technology, aiming to power its next flagship foldable phone. The company is also developing additional Xring chips for AI and autonomous driving, signalling a push to reduce reliance on external chip suppliers and compete with rivals like Huawei.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 4 sources have reported it.

◆ The Wire takeaway

Xiaomi’s move to manufacture advanced chips with TSMC opens production capacity and shifts supply chain control in your sector. You can now target customers moving away from Qualcomm and MediaTek dependency, especially in premium foldable smartphones.

Coverage

4 sources · 24 Aug 2026

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Topics

Semiconductorsxiaomitsmcchip-manufacturingsmartphone-chipfoldable-phone3nm-technology