Wire · technology
GlobalFoundries to Provide Silicon Interposers for CoWoS Advanced Packaging
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Fusion42 · 10 October 2026 · Fusion42 review
GlobalFoundries has signed a $2 billion agreement with TSMC to supply silicon interposers for TSMC's CoWoS advanced packaging, expanding manufacturing capacity at its Malta, New York fab. The production is set to begin mass production by early 2028, establishing the first U.S.-based supply chain for advanced packaging interposers.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 7 sources have reported it between 8 Oct 2026 and 9 Oct 2026.
◆ ◆ The Wire takeaway
You can now count on a US-based supply of silicon interposers for advanced AI chip packaging. If your semiconductor product uses TSMC's CoWoS tech, this opens a domestic manufacturing path and a chance to scale your packaging supply chain more securely.
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7 sources · first reported 8 Oct 2026 · latest 9 Oct 2026
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