Wire · technology
GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for ...
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Fusion42 · 12 October 2026 · Fusion42 review
GlobalFoundries has signed a multi-year $2 billion agreement with TSMC to manufacture silicon interposers at its U.S. Malta, New York facility for TSMC’s CoWoS advanced packaging ecosystem, addressing growing demand for AI and high-performance computing. Volume production is set to begin ramping in the first half of 2028, with potential for capacity expansion.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 8 sources have reported it between 8 Oct 2026 and 12 Oct 2026.
◆ ◆ The Wire takeaway
You need to factor in that GlobalFoundries is establishing the first U.S. source for critical silicon interposers supporting advanced AI chip packaging. This opens a domestic supply line and shortens your risk on long overseas dependencies.
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8 sources · first reported 8 Oct 2026 · latest 12 Oct 2026
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