TSMC taps GlobalFoundries in $2B U.S. chip deal; GFS shares jump 4%

GlobalFoundries secured a $2 billion multi-year contract with TSMC to manufacture silicon interposers in the U.S., expanding fabrication capacity at its Malta, New York facility to support TSMC’s advanced Chip-on-Wafer-on-Substrate packaging from 2028.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 7 sources have reported it between 8 Oct 2026 and 9 Oct 2026.