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Scientech eyes 50% expansion in shipments
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Fusion42 · 3 September 2026 · Fusion42 review
Scientech plans a 50% expansion in shipments this year driven by strong demand for AI-related advanced packaging equipment and reclaimed wafers, with full production utilization and order visibility extending through 2028. The company is also targeting next-generation chip-on-panel-on-substrate packaging and has significantly expanded its workforce to keep up with demand.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
You face a surge in demand for AI-driven semiconductor packaging that outpaces typical supply cycles. Capacity is tight through 2028, pushing you to invest in production scale or targeted partnerships now.
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1 source · 3 Sep 2026
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