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Dow to showcase chip-to-system materials innovation for AI and advanced packaging at ...
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Fusion42 · 2 September 2026 · Fusion42 review
Dow is showcasing advanced silicone materials and co-development capabilities at SEMICON Taiwan 2026, aimed at addressing thermal, mechanical, and integration challenges in semiconductor packaging driven by AI, high-performance computing, and data center applications.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
Dow's move to integrate materials science early in semiconductor packaging design lets you reduce risk and speed product qualification, creating an edge in advanced AI chip markets. You can now shift from choosing materials to co-developing solutions that better handle packaging complexity, speeding time to market.
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1 source · 2 Sep 2026
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