TSMC Taps GlobalFoundries In $2B AI Chip Deal, Putting GFS Stock On Track To Hit Over 1 ...

GlobalFoundries secured a $2 billion manufacturing deal with TSMC to expand its New York facility for producing silicon interposers critical to AI chip packaging, with volume production starting in the first half of 2028. This collaboration addresses TSMC's packaging bottleneck amid soaring AI chip demand and marks a significant expansion of advanced packaging capacity in the U.S.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 5 sources have reported it between 8 Oct 2026 and 10 Oct 2026.