GlobalFoundries to make key AI chip component for TSMC in $2 billion deal

GlobalFoundries has signed a $2 billion deal to produce key silicon interposer components at its Malta, New York facility for TSMC, enabling advanced AI chip packaging and addressing a major supply constraint in AI chip production. Volume production is expected to ramp up in the first half of 2028 with potential for future capacity expansion.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.