PhantaField Announces 3D Chip Architecture Targeting AI Memory Bottlenecks

PhantaField introduced its Sophon 3D chip architecture targeting AI memory bottlenecks by integrating layers of atomically thin semiconductor materials with vertically stacked logic and memory, potentially increasing model weight supply speed by 100X and offering radiation hardness benefits. The architecture is currently theoretical and set for prototype validation, with product availability targeted by 2028.

This Wire brief sits within Fusion42's coverage of Semiconductors.