Samsung introduces zHBM to stack memory vertically on logic chip

Samsung Electronics introduced zHBM, a new 3D memory architecture stacking high-bandwidth memory directly on AI logic processors to significantly boost data processing speed and power efficiency. The architecture achieves up to eight times the performance and threefold better power efficiency compared to HBM5, aiming beyond current HBM4 and HBM4E standards, while also unveiling related advanced NAND technologies.

This Wire brief sits within Fusion42's coverage of Semiconductors.