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Wire · opportunities

Hanmi Semiconductor unveils AI chip 2.5D packaging equipment at Semicon Taiwan

2 September 2026 · By · Wire by Fusion42

Published

2 September 2026

Topic

opportunities

◆ Sectors

Semiconductors

◆ Geography

Asia-Pacific

◆ Source

Read at mbiz.heraldcorp.com →

◆ Verified

Fusion42 · 2 September 2026 · Fusion42 review

Hanmi Semiconductor has showcased advanced 2.5D packaging equipment for AI system semiconductors and TC bonders for HBM at Semicon Taiwan 2026, highlighting its global leadership in the TC bonder market and plans to expand into AI semiconductor packaging.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

AI chip makers and advanced packaging founders must identify the emerging openings from Hanmi's leadership in 2.5D packaging equipment and plan to follow the large HBM bonder market expansion into AI, or risk ceding ground to them.

◆ Coverage

1 source · 2 Sep 2026

◆ Related on Wire

◆ Topics

Semiconductorssemiconductorspackagingai-chipshbm2.5d-packagingtaiwan