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Wire · technology

[News] TSMC: SoIC, CoWoS to Drive 50× Compute by 2029; Silicon Photonics to Top 50 ...

31 August 2026 · By · Wire by Fusion42

Published

31 August 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

Taiwan

◆ Source

Read at trendforce.com →

◆ Verified

Fusion42 · 31 August 2026 · Fusion42 review

TSMC plans to use SoIC and CoWoS integration to increase compute performance 50 times by 2029 and expects silicon photonics to capture over 50% of the optical transceiver market by 2027, with mass production of co-packaged optics starting in late 2026.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

TSMC is pushing computing power far beyond current limits with its advanced chip packaging and silicon photonics. If you supply components or solutions for photonics or chip integration, this roadmap opens immediate chances for new product adoption and scale.

◆ Coverage

1 source · 31 Aug 2026

◆ Related on Wire

◆ Topics

Semiconductorstsmcsilicon-photonicsadvanced-packagingcompute-performanceco-packaged-optics