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Hamamatsu Photonics launches iPHEMOS-DDX for AI chiplet, HBM analysis
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Fusion42 · 30 September 2026 · Fusion42 review
Hamamatsu Photonics has launched the iPHEMOS-DDX, an inverted emission microscope for failure analysis of advanced semiconductor packages including AI chiplets and high bandwidth memory, integrating seven analysis methods with direct tester docking to improve workflow and precision. Orders begin on September 29, 2026, priced at 160 million yen per unit.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
You can now cut failure-analysis time and link testing directly to advanced AI chip and memory packages with Hamamatsu's multi-method microscope. This opens a faster route to spotting defects during real operating conditions and tightens your feedback loop on chip reliability.
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1 source · 29 Sep 2026
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