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ams OSRAM Unveils Breakthrough Thin-Film VCSEL for AI Scale-Up ...

Published

22 September 2026

Topic

opportunities

◆ Sectors

Deep Tech: Telecom & Connectivity

◆ Geography

Europe

◆ Source

Read at newmediawire.com →

◆ Verified

Fusion42 · 22 September 2026 · Fusion42 review

ams OSRAM has introduced a breakthrough Thin-Film VCSEL platform designed for AI scale-up interconnects, enabling highly parallel, wide-and-slow optical architectures that offer significant power efficiency and reliability. The company is expanding its ecosystem with partners like BizLink to develop connectorized multi-core fiber solutions and accelerate industry adoption of these next-generation optical interconnect technologies.

This Wire brief sits within Fusion42's coverage of Deep Tech: Telecom & Connectivity.

◆ ◆ The Wire takeaway

You must shift focus to wide-and-slow optical architectures with ams OSRAM's new VCSEL tech if you build AI data infrastructure. This opens a direct route to reduce AI cluster power use and complexity, making your hardware more competitive.

◆ Coverage

1 source · 22 Sep 2026

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◆ Topics

Deep Tech: Telecom & Connectivitythin-film-vcselai-infrastructureoptical-interconnectmulti-core-fiberenergy-efficiencyecosystem-expansion