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ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing ...
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Fusion42 · 21 September 2026 · Fusion42 review
ams OSRAM has unveiled a breakthrough Thin-Film VCSEL platform designed for AI scale-up networks, featuring addressable microVCSEL arrays and a connectorized multi-core fiber solution developed with BizLink to enable highly parallel, energy-efficient optical interconnects with low latency and high bandwidth.
This Wire brief sits within Fusion42's coverage of Deep Tech: Telecom & Connectivity.
◆ ◆ The Wire takeaway
You face an opening to cut power and complexity in AI cluster interconnects by shifting to optical lanes distributed wide-and-slow rather than few complex channels. This partnership with BizLink signals a clearer route to bring these scalable photonics solutions into your network architecture.
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1 source · 21 Sep 2026
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