Cadence rolls out AI agent to speed circuit board, chip packaging design

Cadence Design Systems launched AuraStack, an AI agent that automates circuit board and chip package design using plain-language instructions, claiming time-to-market cuts of up to 50% and task productivity gains up to 15-fold. The tool integrates with Cadence's existing software, runs on Nvidia chips, and will be available by September 2026 with consumption-based pricing.

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