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SK hynix Verifies HBM5 with TSMC
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Fusion42 · 28 September 2026 · Fusion42 review
SK hynix showcased and validated its next-generation AI memory products including HBM5 with TSMC's advanced 2.5D packaging technology at the TSMC Open Innovation Platform Conference, receiving the Partner of the Year award for the second consecutive year. The company highlighted its extensive AI infrastructure product lineup and plans for chiplet-based PCIe Gen 6 and 7 SSD solutions targeting AI workloads and scaling data center demands.
This Wire brief tracks SK hynix, and It sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.
◆ ◆ The Wire takeaway
AI chip makers must rethink memory partnerships as SK hynix and TSMC push HBM5 with advanced packaging that powers new Nvidia GPUs. You should explore partnerships for chiplet SSD designs to meet rising AI server demands.
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2 sources · 28 Sep 2026
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